BGA-Underfill Dispense Robot
▪ Dispense underfill glue on PCB board with BGA installed.
▪ Machine features: with heating system and sliders installed with certain angle.
▪ With glue low-level monitor system and precision valve mounted.
▪ Two X axis (X1,X2) make production more efficient.
BGA-Underfill Dispense Robot
▪ Dispense underfill glue on PCB board with BGA installed.
▪ Machine features: with heating system and sliders installed with certain angle.
▪ With glue low-level monitor system and precision valve mounted.
▪ Two X axis (X1,X2) make production more efficient.