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Fluid device
IG2300 Underfill Inline Machine
▪ Dispense underfill glue on PCB board with BGA(Ball Grid Array).

▪ Applicable to underfill gluing process with touch-screen operation system.

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IG2300 Underfill Inline Machine
▪ Dispense underfill glue on PCB board with BGA(Ball Grid Array).

▪ Applicable to underfill gluing process with touch-screen operation system.