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Customized Device
Fluid device
SSCV100 Dispense Valve

- Applicable to accurately nano dot and line coating


- Easy to use and maintain


- With specialized controller for adjusting glue volume easily
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Size specification Product characteristics Application range Product video

- Applicable Material: silver adhesive, cream solder, expose and high-viscosity liquid, etc.


- Application Area: chip bounding, dam&fill, etc.

- Maximum Hydraulic Pressure: 7 kgf/cm2

- Applicable Air Pressure: 4～5 kgf/cm2


- Applicable Temperature: 5℃～60 ℃



- Applicable Material: silver adhesive, cream solder, expose and high-viscosity liquid, etc.


- Application Area: chip bounding, dam&fill, etc.

- Maximum Hydraulic Pressure: 7 kgf/cm2

- Applicable Air Pressure: 4～5 kgf/cm2


- Applicable Temperature: 5℃～60 ℃